XC7VX485T-3FFG1157E产品详细规格

规格书 XC7VX485T-3FFG1157E datasheet 规格书

Virtex-7 T/XT FPGA Datasheet

Virtex-7 FPGAs Brief

7 Series FPGAs Overview

文档 Additional Wafer Fabrication 16/Dec/2013

的LAB / CLB数 37950 

安装类型 Surface Mount 

逻辑元件/单元数 485760 

标准包装 1 

供应商设备封装 1157-FCBGA (35x35) 

RAM位总计 37969920 

工作温度 0°C ~ 100°C 

电压 - 电源 0.97 V ~ 1.03 V 

I / O针脚数 600 

封装/外壳 1157-BBGA, FCBGA 

XC7VX485T-3FFG1157E系列产品 

型号

厂家

产品描述

XC7VX485T-3FFG1158E  IC FPGA 485K VIRTEX-7 

XC7VX485T-3FFG1761E  IC FPGA 485K VIRTEX-7 

XC7VX485T-3FFG1927E  IC FPGA 485K VIRTEX-7 

XC7VX485T-3FFG1930E  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FF1157C  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FF1157I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FF1761I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FF1930I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1157C  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1157I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1158C  IC FPGA 485K VIRTEX-7 1158FBGA 

XC7VX485T-1FFG1158I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1761C  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1761I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1927C  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1927I  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1930C  IC FPGA 485K VIRTEX-7 

XC7VX485T-1FFG1930I  IC FPGA 485K VIRTEX-7 

XC7VX485T-2FF1157C  IC FPGA 485K VIRTEX-7 

XC7VX485T-2FFG1157C  IC FPGA 485K VIRTEX-7 

芯片详细信息

Manufacturer Part Number:

XC7VX485T-3FFG1157E

Pbfree Code:

 Yes

Rohs Code:

 Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

Part Package Code:

BGA

Package Description:

FBGA-1157

Pin Count:

1157

Reach Compliance Code:

not_compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Manufacturer:

Xilinx

Risk Rank:

5.8

Clock Frequency-Max:

1818 MHz

Combinatorial Delay of a CLB-Max:

0.58 ns

JESD-30 Code:

S-PBGA-B1157

JESD-609 Code:

e1

Length:

35 mm

Number of CLBs:

37950

Number of Inputs:

600

Number of Logic Cells:

485760

Number of Outputs:

600

Number of Terminals:

1157

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-55 °C

Organization:

37950 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1156,34X34,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1,1.8 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.35 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.03 V

Supply Voltage-Min:

0.97 V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

MILITARY

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

35 mm